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almd-lg37, almd-ll37, almd-lm37, almd-lb37 high brightness smt oval led lamps amber, red, green and blue data sheet caution: ingan devices are class 1c hbm esd sensitive, alingap devices are class 1b esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. description the new avago almd-lx37 oval led series has the same or just slightly less luminous intensity than conventional high brightness through holes leds. the new oval led lamps can be assembled using common smt assembly processes and are compatible with indus - trial refow soldering processes. the leds are made with an advanced optical grade epoxy for superior performance in outdoor sign applications. the surface mount oval leds are specifcally designed for full color / video signs and indoor or outdoor passenger information sign applications. for easy pick and place assembly, the leds are shipped in tape and reel. every reeled is shipped from a single intensity and color bin except the red color for better uni - formity. package dimensions features ? well defned spatial radiation pattern ? high brightness material ? available in red, amber, green and blue color: C red alingap 626 nm C amber alingap 590 nm C green ingan 525 nm C blue ingan 470 nm ? jedec msl 2a ? compatible with refow soldering process ? tinted and difused lens ? wide viewing angle: 40 x 100 applications ? full color signs ? mono color signs notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.20 mm unless other specifed. 3. mildsteel leadframe. caution: customer is advised to always keep the led in the moisture barrier bag with <5%rh when not in use as prolonged exposure to environment might cause the leads to tarnish or rust, which might cause difculties in soldering. package marking (anode mark) a - anode c - cathode c c a a 4.20 0.20 4.20 0.20 1.00 1.4 (4x) 1.60 0.50 5.20 0.50 2.50 3.40 0.50 4.75 0.50
2 device selection guide part number color and dominant wavelength d (nm) typ luminous intensity iv (mcd) [1,2,5] viewing angle typ - [4] min max almd-lg37-xz002 red 626 1660 2900 40 x 100 almd-ll37-xz002 amber 590 1660 2900 40 x 100 almd-lm37-24002 green 525 3500 6050 40 x 100 ALMD-LB37-SU002 blue 470 660 1150 40 x 100 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. the optical axis is closely aligned with the package mechanical axis. 3. dominant wavelength, d, is derived from the cie chromaticity diagram and represents the color of the lamp. 4. ? is the of-axis angle where the luminous intensity is half the on-axis intensity. 5. tolerance for each bin limit is 15% part numbering system a l m d - x1 x2 x3 x4 - x5 x6 x7 x8 x9 code description option x1 package type l oval alingap/ingan x2 color b g l m blue red amber green x3x4 viewing angle 37 40 x 100 x5 minimum intensity bin refer to device selection guide x6 maximum intensity bin refer to device selection guide x7 color bin selection 0 full distribution x8x9 packaging option 02 tested 20ma, 13inch carrier tape
3 absolute maximum rating, t j = 25 c parameter red and amber green blue unit dc forward current [1] 50 30 20 ma peak forward current 100 [2] 100 [3] 100 [3] ma power dissipation 120 114 76 mw led junction temperature 110 c operating temperature range -40 to +85 c storage temperature range -40 to +100 c notes: 1. derate linearly as shown in figure 4 and figure 9. 2. duty factor 30%, frequency 1khz. 3. duty factor 10%, frequency 1khz. electrical / optical characteristics, t j = 25 c parameter symbol min. typ. max. units test conditions forward voltage red amber green blue v f 1.8 1.8 2.8 2.8 2.1 2.1 3.2 3.2 2.4 2.4 3.8 3.8 v i f = 20 ma reverse voltage [3] red & amber green & blue v r 5 5 v i r = 100 m a i r = 10 m a dominant wavelength [1] red amber green blue d 618.0 584.5 519.0 460.0 626.0 590.0 530.0 470.0 630.0 594.5 539.0 480.0 i f = 20 ma peak wavelength red amber green blue peak 634 594 516 464 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance red amber green blue r j-pin 270 270 270 480 c/w led junction-to-pin luminous efcacy [2] red amber green blue h v 200 490 530 65 lm/w emitted luminous power/emitted radiant power thermal coefcient of d red amber green blue 0.059 0.103 0.028 0.024 nm/c i f = 20 ma ; +25c t j +100c notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp. 2. the radiant intensity, ie in watts per steradian, may be found from the equation ie = i v / h v where i v is the luminous intensity in candelas and h v is the luminous efcacy in lumens/watt. 3. indicates product fnal testing condition. long term reverse bias is not recommended.
4 alingap 0.0 0.2 0.4 0.6 0.8 1.0 500 550 600 650 wavelength - nm relative intensity amber red 0 10 20 30 40 50 60 0 0.5 1 1.5 2 2.5 3 forward current - ma forward voltage - v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 10 20 30 40 50 60 relative luminous inensity (normalized at 20ma) forward current - ma 0 10 20 30 40 50 60 0 20 40 60 80 100 maximum forward current - ma ambient temperature (c) -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 1.2 0 10 20 30 40 50 60 dominant wavelength shift - nm forward current - ma red amber red amber r ja = 660 c/w r ja = 460 c/w figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative intensity vs forward current figure 4. maximum forward current vs ambient temperature figure 5. relative dominant wavelength shift vs forward current
5 ingan 0.0 0.2 0.4 0.6 0.8 1.0 380 430 480 530 580 630 wavelength - nm relative intensity -10 -5 0 5 10 0 20 40 60 80 100 forward current-ma relative dominant wavelength shift (normalized at 20ma) 0 10 20 30 40 0 20 40 60 80 100 maximum forward current - ma ambient temperature (c) blue green green blue blue green forward voltage-v forward current-ma 0 5 10 15 20 25 30 0 1 2 3 4 dc forward current-ma 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 5 10 15 20 25 30 relative luminous intensity (normalized at 20ma) figure 6. relative intensity vs wavelength figure 7. forward current vs forward voltage figure 8. relative intensity vs forward current figure 9. maximum forward current vs ambient temperature figure 10. dominant wavelength shift vs forward current
6 0 0 . 2 0 . 4 0 . 6 0 . 8 1 - 9 0 - 6 0 - 3 0 0 3 0 6 0 9 0 n o r m a l i z e d i n t e n s i t y a n g u l a r d i s p l a c e m e n t - degrees 0 0.2 0.4 0.6 0.8 1 - 90 - 60 - 30 0 30 60 90 normalized intensity a n g u l a r d i s p l a c e m e n t - degrees am ber r ed green blue am ber r ed green blue figure 11a. radiation pattern for major axis figure 11b. radiation pattern for minor axis figure 12. relative intensity shift vs junction temperature figure 13. forward voltage shift vs junction temperature 0.1 1 10 -40 -20 0 20 40 60 80 100 120 normalzied intensity (photo) tj - junction temperature (c) -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 -40 -20 0 20 40 60 80 100 120 forward voltage shift - v tj - junction temperature (c) green blue red amber green blue red amber figure 14. recommended soldering land pattern note: recommended stencil thickness is 0.1524mm (6 mils) minimum and above 5.2 2.1 4.0 0.7
7 figure 15. carrier tape dimension 4.500.20 2.200.20 2.000.20 4.000.20 8.000.20 16.000.30 7.500.20 1.750.20 5.900.20 4.100.20 0.500.10 1.800.20 5.200.20 1.550.20 1.600.20 ? 100 0.50 ? 330 max. 16.40 0.20 13.00 0.20 figure 16. reel dimension figure 17. unit orientation from reel 2 anode leads lead unreeling direction
8 intensity bin limit table (1.2:1 iv bin ratio) bin intensity (mcd) at 20 ma min max s 660 800 t 800 960 u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 tolerance for each bin limit is 15% vf bin table (v at 20 ma) for red & amber bin id min max vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 tolerance for each bin limit is 0.05v red color range min dom max dom xmin ymin xmax ymax 618.0 630.0 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 tolerance for each bin limit is 0.5 nm amber color range bin min dom max dom xmin ymin xmax ymax 1 584.5 587.0 0.5420 0.4580 0.5530 0.4400 0.5370 0.4550 0.5570 0.4420 2 587.0 589.5 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 4 589.5 592.0 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 6 592.0 594.5 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 tolerance for each bin limit is 0.5 nm green color range bin min dom max dom xmin ymin xmax ymax 1 519.0 523.0 0.0667 0.8323 0.1450 0.7319 0.1200 0.7375 0.0979 0.8316 2 523.0 527.0 0.0979 0.8316 0.1711 0.7218 0.1450 0.7319 0.1305 0.8189 3 527.0 531.0 0.1305 0.8189 0.1967 0.7077 0.1711 0.7218 0.1625 0.8012 4 531.0 535.0 0.1625 0.8012 0.2210 0.6920 0.1967 0.7077 0.1929 0.7816 5 535.0 539.0 0.1929 0.7816 0.2445 0.6747 0.2210 0.6920 0.2233 0.7600 tolerance for each bin limit is 0.5 nm blue color range bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 tolerance for each bin limit is 0.5 nm
9 note: acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but with - out vf bin or part number with vf bins and no color bin) (ii) color bin incorporated with vf bin applicable for part number that have both color bin and vf bin example: a. color bin only or vf bin only bin: 4 (represent color bin 4 only) bin: va (represent vf bin va only) b. color bin incorporate with vf bin b in: 4 va va: vf bin ?va? 4: color bin 4 only packing label (i) mother label (available on mbb bag) (ii) baby label (available on plastic reel) (1 p) i t e m: p a rt n u m b e r (1 t ) l o t : l o t n u mb e r l pn : (9 d )mf g d a t e : ma n u f a ct u ri n g d a t e (p) c u st o m e r i t e m: (v) ve n d o r i d : d e p t i d : o eat 0 1 ma d e i n : c o u n t ry o f o ri g i n (q ) q t y: q u a n t i t y c at : i n t e n si t y bi n bi n : r e f e r t o b e l o w i n f o r ma t i o n (9 d ) d a t e c o d e : d a t e c o d e st an d ar d l abel l s 0 0 0 2 r o h s c o m p l i a n t e 4 ma x t e m p 2 6 0 c msl 2 a (1 p) pa r t # : pa rt n u mb e r (1 t ) l o t # : l o t n u m b e r (9 d )mf g d a t e : ma n u f a ct u ri n g d a t e c / 0 : c o u n t ry o f o ri g i n (1 t ) t ape d a t e: t a p i n g d a t e (q ) q t y: q u a n t i t y (9 d ) d a t e c o d e : d a t e c o d e baby l abe l c o sbo o 1 b v0 . 0 c at i n t e n si t y bi n bi n r e f e r t o b e l o w i n f o r ma t i o n
10 soldering recommended refow soldering condition: a. refow soldering must not be done more than two times. do observe necessary precautions for handling a moisture-sensitive device, as stated in the following section. b. recommended board refow direction: (i) leaded refow soldering: (ii) lead-free refow soldering: c. do not apply any pressure or force on the led during refow and after refow when the led is still hot. d. it is preferred that you use refow soldering to solder the led. use hand soldering only for rework if unavoidable but must be strictly controlled to the following conditions: - soldering iron tip temperature = 320 c max. - soldering duration = 3 sec max. - number of cycles = 1 only - power of soldering iron = 50 w max. e. do not touch the led body with a hot soldering iron except the soldering terminals as this may damage the led. f. for de-soldering, it is recommended to use appropriate double head soldering iron. user is advised to confrm beforehand whether the functionality and performance of the led is afected by hand soldering. 240c ma x. 20 sec. ma x. 3c/sec. ma x. 120 sec. ma x. time temperature 183c 100-150c -6c/sec. ma x. 60-150 sec. 3c/sec. ma x. 217 c 200 c 60 - 120 sec. 6 c/sec. ma x. 3 c/sec. ma x. 3 c/sec. ma x. 150 c 255 - 260 c 100 sec. ma x. 10 t o 30 sec. time temperature
11 precautionary notes 1. handling precautions for automated pick and place, avago has tested nozzle size below made with urethane material to be working fne with this led. however, due to the possibility of variations in other parameters such as pick and place machine maker/model and other settings of the ma - chine, customer is recommended to verify the nozzle selected. d. control of assembled boards - if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure that all leds have not exceeded their foor life of 672 hours. e. baking is required if: - the hic indicator is not brown at 10% and is azure at 5%. - the leds are exposed to condition of >30c / 60% rh at any time. - the led foor life exceeded 672hrs. the recommended baking condition is: 605oc for 20hrs. baking should only be done once. f. storage - the soldering terminals of these avago leds are silver plated. if the leds are being exposed in ambient environment for too long, the silver plating might be oxidized and thus afecting its solderability performance. as such, unused leds must be kept in sealed mbb with desiccant or in desiccator at <5%rh. 3. application precautions a. drive current of the led must not exceed the maximum allowable limit across temperature as stated in the datasheet. constant current driving is recommended to ensure consistent performance. b. led is not intended for reverse bias. do use other appropriate components for such purpose. when driving the led in matrix form, it is crucial to ensure that the reverse bias voltage is not exceeding the allowable limit of the led. c. avoid rapid change in ambient temperature especially in high humidity environment as this will cause condensation on the led. d. if the led is intended to be used in outdoor or harsh environment, the led leads must be protected with suitable potting material against damages caused by rain water, oil, corrosive gases etc. it is recommended to have louver or shade to reduce direct sunlight on the leds. 4. eye safety precautions leds may pose optical hazards when in operation. it is not advisable to view directly at operating leds as it may be harmful to the eyes. for safety reasons, use ap - propriate shielding or personal protective equipments. note: 1. nozzle tip should touch the led fange during pick and place. 2. outer dimensions of the nozzle should be able to ft into the carrier tape pocket. 2. handling of moisture-sensitive device this product has a moisture sensitive level 2a rating per jedec j-std-020. refer to avago application note an5305, handling of moisture sensitive surface mount devices, for additional details and a review of proper handling procedures. a. before use - an unopened moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe to refow the leds per the original msl rating. - it is recommended that the mbb not be opened prior to assembly (e.g. for iqc). b. control after opening the mbb - the humidity indicator card (hic) shall be read immediately upon opening of mbb. - the leds must be kept at <30c / 60%rh at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. c. control for unfnished reel - unused leds must be stored in a sealed mbb with desiccant or desiccator at <5%rh. pick & place nozzle led ange >2.2mm 4.00 4.00 3.20 5.00
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2015 avago technologies. all rights reserved. av02-4541en - may 14, 2015 disclaimer: avagos products and software are not specifcally designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.

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